ram_ControllerLPDDR2，LVDDR3，DDR3usbUSB 2.0 + PHY（3）sata–Operating temperature0°C ~ 95°C（TJ）Coprocessor_dspMultimediaNEON™ SIMDVendor device packaging432-MAPBGA（13×13）Minimum quantity1.0Safety featuresARM TZ，Safe start，Password technology，RTIC，Safety fuse box，Safety JTAG，Secure memory，Safety RTC，Tamper detectionGraphics accelerationIsSquare_Casing432-TFBGAPackagingTrayDisplay and interface controllers小键盘，LCDSeriesi.MX6SLTelecommunications_i_o1.2V，1.8V，3.0VBidirectional1.0GHzqty0.0Core count_Bus width1 核，32 Bit核心ProcessorARM® Cortex®-A9Ethernet10/100Mbps（1）